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Jenny Gerson on Evolving Cooling Strategies for High-Density AI
Jenny Gerson on Evolving Cooling Strategies for High-Density AI

Jenny Gerson on Evolving Cooling Strategies for High-Density AI

  • Updated on July 16, 2025
  • /
  • 2 min read

Data centers are consuming staggering amounts of water for cooling, with certain U.S. areas using seven billion liters annually. Traditional evaporative cooling uses drastically more water than conventional air cooling as rack densities increase. Industry experts identify three main alternatives: closed-loop systems, direct-to-chip cooling, and immersion cooling.

The shift toward liquid cooling is driven by physics rather than preference. Increasing power demands and chip temperatures are pushing the limits of single-phase cooling, making liquid solutions necessary. Companies like Microsoft are prioritizing closed-loop designs that eliminate water consumption.

“As data centers are continuing to evolve, as there’s more high density and higher cooling needs, we’re bringing the cooling closer to the chips. So, either at the rack level, at the server level, or at the chips themselves.”
— Jenny Gerson, Senior Director of Sustainability, DataBank

Innovation timelines have compressed dramatically. HVAC product development once required three to five years, but today’s rapid chip evolution demands faster adaptation. Geographic considerations also shape strategies, with warmer climates like Arizona requiring different approaches than cooler regions where free cooling systems can be utilized.

Immersion cooling represents the frontier, submerging entire racks in dielectric fluids to capture 100% of heat, though operational challenges remain.

For the complete analysis on data center cooling evolution, read the full article at ITPro.

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